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Prof. Trevor Mudge (from Univ. of Michigan) gave a talk

撰稿: 摄影: 发布时间:2007年06月22日

On 31 May 2007, Prof. Trevor Mudge (from Univ. of Michigan) gave a talk "PicoServer - Building a Compact Energy Efficient Multiprocessor".

Abstract: With power and cooling becoming an increasingly costly part of the operating budget of a server, the old trend of striving for higher performance with little regard for power is over. Emerging semiconductor process technologies, multicore architectures, and new interconnect technology provide an avenue for future servers to become low power, compact, and possibly mobile. In talk we examine two techniques for achieving low power: 1)3D die stacking; and 2) replacing DRAM with Flash memory. 3D die stacking technology can bond multiple dies together vertically and provide millions of connections between layers. In this talk, we examine the case for a PicoServer, a multicore architecture using 3D stacking to implement a simple, low-power, high-performance server system. Secondly, we will show how Flash memory, a low power high density non-volatile memory technology, can be used to replace DRAM, lowering the power of the main memory, to further reduce power.

Bio: Trevor Mudge received the Ph.D. degree in Computer Science from the University of Illinois, Urbana, in 1977. Since then, he has been on the faculty of the University of Michigan, Ann Arbor. Three years ago he was named the first Bredt Family Professor of Electrical Engineering and Computer Science after concluding a ten year term as the Director of the Advanced Computer Architecture Laboratory -- a group of about 8 faculty and 80 graduate students. He is author of numerous papers on computer architecture, programming languages, VLSI design, and computer vision. He has also chaired 33 theses in these research areas. In addition to faculty position, he runs Idiot Savants, a chip design consultancy. Trevor Mudge is a Fellow of the IEEE, a member of the ACM, the IET, and the British Computer Society.

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